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An Innovative Hybrid Cleaning Approach for Contaminant Removal in Semiconductor Packaging

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875246

Authors: Chun Yuan Lim, Meng Kong Heng, Mee Sing Tiong, Kwang Jun Lee

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4407575378

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Cites: 5

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Related to: 10