Automotive High Power Flip Chip Quad Flat No-leads Package Robustness Study
Year: 2024
Type: conference-paper
Authors: Wen Yuan Chuang, Wen Hung Huang, Eu Poh Leng, Ade Tsai, Fenny Li, Daisuke Hosoda
Institutions: Advanced Semiconductor Engineering (Taiwan), NXP (Germany)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4407575381