Voiding Control of Lead-Free Soldering at Quad-flat No-lead package Components
Year: 2024
Type: conference-paper
Authors: Li Ma, Jinjin Bai, Fen Chen, Yan Liu
Institution: Indium Corporation (United States)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4407575382