Work

Exploring the Correlation Between Post-Die Bond Epoxy Void and Bond Line Thickness and other Factors on Power Packaging with Silver Sintered Epoxy

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875307

Authors: Jae Yun Kim, Azham Mohd Sukemi, Eu Poh Leng, SeongKuk Kang, SunKyong Kim

Institution: NXP (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: NXP Semiconductors

OpenAlex ID: W4407575389

FWCI:

Cites: 3

Cited by:

Related to: 10