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Computational Fluid Dynamics Approach to Enhance Capillary Underfill Encapsulant Process in Heterogenous Package

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875195

Authors: Muhammad Aqil Azman, Loh Wei Keat, Ooi Chun Keang, Mohd Zulkifly Abdullah

Institutions: Intel (Malaysia), Universiti Sains Malaysia

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4407575391

FWCI:

Cites: 4

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Related to: 10