Wave Solder Process characterization in PCBA
Year: 2024
Type: conference-paper
Authors: Jui Ang Tan, Chee Chuan Tan, Kum Foo Leong
Institutions: Intel (Malaysia), Intel (United States)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4407575397