Work

Galvanic corrosion behavior of Ag-filled electrically conductive adhesive on Sn-plated of surface mount chip resistor

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875290

Authors: Onanong Phosri, Kornteenee Pairpisit, Chayathorn Saklang, Kittichai Fakpan, Amar Mavinkurve

Institutions: King Mongkut's University of Technology North Bangkok, NXP (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4407575416

FWCI:

Cites: 7

Cited by:

Related to: 10