Work

Refined Wire Bond Pad Cratering Testing Method

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875272

Authors: Andrea Goh, Leong Chung Ling

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4407575418

FWCI:

Cites: 7

Cited by:

Related to: 10