Work

Recent iNEMI Research on Electromigration in Tin-Bismuth Solder

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875254

Authors: Prabjit Singh, Larry Palmer, Thomas Wassick, Raiyo Aspandiar, Brian Franco, Lavanya Ashok Swaminathan, Haley Fu, Faramarz Hadian, Richard Coyle, Terry Munson, Steve Middleton, Hongwen Zhang, Anna Lifton, Keith Howell, Vasu Vasudevan, Kei Murayama, Sarangapani Murali

Institutions: IBM (United States), Intel (United States), Foresite (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4407575429

FWCI:

Cites: 14

Cited by:

Related to: 10