Work

Study of Glue Creeping Behavior On Die Surface for Thin Die Using Roughen Pre-plated Leadframe

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875210

Authors: Nara Tappetch, Yothin Komchuad, Kanthorn Sarpithak, Watcharapol Kundalaputra, Pairat Sungchoom, Kornteenee Pairpisit, Akkachai Potitaram, Ittipon Intamart

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4407575442

FWCI:

Cites: 6

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Related to: 10