Work

Effect Of Anti-Epoxy Bleed Out Concentration And Leadframe Plating Condition Towards Die Attach Glue Bleed Out Performance

Year: 2024

Type: conference-paper

DOI: 10.1109/iemt61324.2024.10875242

Authors: Mohamad Syahirul Syafiq Ali, Muhammad Danial Afiq Mohamad Ghazali, Cheeyee Heng

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4407575446

FWCI:

Cites: 4

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Related to: 10