Work

Investigation of the Microstructures and Mechanical Properties of Sn-Cu-Bi-In-Ni Solders

Year: 2025

Type: article

Abstract: The development of Ag-free Sn solders has attracted significant attention due to the requirement of high-density electronic packaging. In this study, we investigate the Ni element on the microstructures and mechanical properties of Ag-free Sn-Cu-Bi-In solders. This paper details the microstructures and phases of the as-prepared Sn-Cu-Bi-In-Ni solders, as well as its mechanical properties. Specifically, the intermetallic compound (IMC) Cu6Sn5 is observed to be distributed in the Sn matrix, forming near-eutectic structures. The incorporation of Ni into Sn-Cu-Bi-In enhances the mechanical properties of the solder joints, including the shear strength and vibrational stability. In the joint obtained using the as-prepared Sn-Cu-Bi-In-Ni solders, a (Cu,Ni)6Sn5 IMC layer forms at the interface between Sn ball and Cu pad. The beneficial effects of Ni can be primarily attributed to its ability to adjust the mechanical properties and thermal expansion, enhancing the stability of solder joints. A TEM analysis reveals the closely packed atomic interface of Cu/(Cu,Ni)6Sn5 and (Cu,Ni)6Sn5/Sn, elucidating the joining mechanism involved.

Source: Materials

DOI: 10.3390/ma18040858

Authors: Xiaochun Lv, Chenghao Zhang, Yang Liu, Zhen Pan, Zhiyuan Wang, Fenglian Sun

Institution: Harbin University of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: gold

Estimated APC paid: $3,137

Funder: Key Research and Development Program of Heilongjiang