More chip circuit board heat dissipation structure design and analysis
Year: 2024
Type: conference-paper
Authors: Wen Jia, Runjing Zhou, Wenjie Xu, Xiangdong Lu
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Funder: Inner Mongolia University
OpenAlex ID: W4407639624
