Work

Investigation of Gate-Length Scaling Effects on the Thermal Reliability of 25T-TSPC Flip-Flop

Year: 2024

Type: conference-paper

DOI: 10.1109/isense63713.2024.10872273

Authors: Syeda Hurmath Juveria, Shashank Rebelli, J. Ajayan

Institution: SR University

Language: English

Topic: Low-power high-performance VLSI design

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4407639772

FWCI:

Cites: 12

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Related to: 10