Work

Pushing the Limits of Miniaturization in Microelectronic Packaging via the Application of Ultra-Thin Micro Dam Structures

Year: 2025

Type: article

Source: IMAPSource Proceedings

DOI: 10.4071/001c.129757

Authors: Patrick Schirmer, Severin Ringelstetter, Kian Chong Tai, Muizzuddin Azfar

Institution: Government of New South Wales

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4407640675

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