Year: 2025
Type: article
Abstract: Additive manufacturing (AM) opens up a world of possibilities for creating next-generation electronics. However, employing AM technologies in microfabrication presents its own unique set of challenges. The ongoing trend towards miniaturization necessitates the printing of ultra-thin, high-density conductive interconnections in 3D packages and heterogeneous systems. In the presentation, we will showcase how the innovative technology of Ultra-Precise Dispensing (UPD) effectively addresses these challenges, how this microfabrication process is already used in advanced R&D and prototyping projects, and our current approach towards the use of the UPD approach in large-scale manufacturing.
Source: IMAPSource Proceedings
DOI: 10.4071/001c.129769
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W4407640695