Year: 2025
Type: article
Abstract: The thermal-fatigue reliability of flip chip micro solder joints on glass core build-up package substrate and C4 (controlled collapse chip connection) solder joints on printed circuit board (PCB) is investigated. Emphasis is placed on the structural deformation and the accumulated inelastic strain at the critical locations of the micro and C4 solder joints. Some recommendations are also provided.
Source: IMAPSource Proceedings
DOI: 10.4071/001c.129522
Authors: John H Lau, Ning Liu, Mike Ma, Tzyy-Jang Tseng
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W4407640806