Work

Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous Integration

Year: 2025

Type: article

Abstract: In this study, the fan-out chip-last panel-level packaging in fabricating an ultra-large organic interposer of a hybrid substrate for heterogeneous integration is investigated. Emphasis is placed on the design, materials, process, fabrication, and reliability of a hybrid substrate (85 mm x 80 mm) with an ultra-large organic interposer (5 RDLs with the minimum metal line width (L) and spacing (S) = 2 μm) and a 5-2-5 build-up package substrate. Also, some recommendations are provided.

Source: IMAPSource Proceedings

DOI: 10.4071/001c.129610

Authors: C. Lin, J. H. Lau, C. Chen, H. Yang, T. Xia, C. Ko, B. Lin, M. Ma, T. Tseng

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: bronze

OpenAlex ID: W4407641378

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