Advancing Semiconductor Packaging: Intelligent Architectures for Heterogeneous Integration Assembly
Year: 2025
Type: article
Abstract: The semiconductor industry is undergoing a profound transformation driven by the growing demand for enhanced performance, reduced energy consumption, faster time-to-market, and increased functionality. However, this evolution is accompanied by significant challenges, notably escalating costs over the past decade. Advanced packaging technologies leveraging Heterogeneous Integration (HI) have emerged as indispensable solutions to address these challenges and meet the dynamic demands of the market. This paper emphasizes the critical need for innovative and intelligent system architectures to overcome the hurdles in semiconductor packaging, particularly in achieving efficient Heterogeneous Integration assembly with the highest yield and optimal economics.
Source: IMAPSource Proceedings
DOI: 10.4071/001c.129617
Author: Glenn Farris
Institution: Universal Instruments (United States)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W4407641516