Year: 2025
Type: article
Abstract: Utilizing metastable fine-grain copper offers an opportunity to implement low-thermal budget hybrid bonding techniques. We outline several methods for characterizing fine-grain structures and a screening process to refine these structures. Furthermore, we explore the differences in copper grain evolution between blanket and patterned wafers at room temperature. Finally, we introduce metastable fine-grain copper, which demonstrates stability for four weeks of self-annealing and maintains stability through annealing at 150°C for 2 hours, with grain growth occurring at 250°C. The capability to maintain fine-grain copper over an extended period presents a promising solution for low-thermal budget hybrid bonding.
Source: IMAPSource Proceedings
DOI: 10.4071/001c.129765
Authors: Pingping Ye, Jianwen Han, Stephan Braye, Abdelhamid ElSawy, Harshul Khanna, Veronica Hayes, Adam Letize, Kyle Whitten, Thomas Richardson, Elie Najjar
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W4407641544