Work

Asymmetric Bidirectional Pulse Electrodeposition Enabling Super-Filling of Through Glass Vias With Large Aperture and High Aspect Ratio

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3543363

Authors: Chuanxi Liang, Yun Chen, Yuanhui Guo, Wenxuan Wu, Maoxiang Hou, Huilong Liu, Li Ma, Xin Chen, Chingping Wong

Institutions: Guangdong University of Technology, Georgia Institute of Technology

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Research Foundation, National Natural Science Foundation of China, Basic and Applied Basic Research Foundation of Guangdong Province

Awards: G4497129687, G6442306363, G6654615587, G8089054809, G8145344217, G981922341

OpenAlex ID: W4407690793

FWCI: 1.356

Cites: 37

Cited by: 6

Related to: 10