Work

Reliability Study of Through Ceramic Via Substrate Under Temperature Conditions

Year: 2024

Type: conference-paper

Source: Global Reliability and Prognostics and Health Management Conference (PHM)

DOI: 10.1109/phm-beijing63284.2024.10874602

Authors: Yongzhi Zhao, Xinwei Tian, Lixiang Zhang, Xuejiao Zhang

Institutions: China Electronics Technology Group Corporation, Shijiazhuang Tiedao University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4407692536

FWCI: 0.806

Cites: 10

Cited by: 1

Related to: 10