Work

Low Loss Chip‐to‐Chip Couplers for High‐Density Co‐Packaged Optics

Year: 2025

Type: article

Abstract: Co-Packaged Optics In article number 2402095, Drew Weninger, Samuel Serna, and co-workers present a co-packaged optics system with an electrical chip (black, center) surrounded by 8 silicon photonic chips. Chips are bonded using an automated pick-and-place tool, shown placing the final chip into position. The automation is enabled by a novel optical chip-to-chip coupler (green callout).

Source: Advanced Engineering Materials

DOI: 10.1002/adem.202570012

Authors: Drew Weninger, Samuel Serna, Luigi Ranno, Lionel Kimerling, Anuradha Agarwal

Institutions: Massachusetts Institute of Technology, Bridgewater State University

Language: English

Topic: Photonic and Optical Devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: bronze

OpenAlex ID: W4407702040

FWCI:

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