Work

Improving uniformity in high aspect ratio through-silicon vias through spectral reflectometry for etch process control

Year: 2025

Type: article

Source: Journal of Micro/Nanopatterning Materials and Metrology

DOI: 10.1117/1.jmm.24.1.014003

Authors: Wen Qii Cheah, Yi-sha Ku, Po Wen Chou, Chun-Wei Lo

Institutions: National Tsing Hua University, Industrial Technology Research Institute

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4407729605

FWCI: 0.693

Cites:

Cited by: 3

Related to: 10