Year: 2025
Type: article
Abstract: This summary furnishes an elaborate analysis of the integration of LMP metals with semiconductor materials. To commence, the article delineates the selection criteria, which incorporate the physical and chemical traits of low-melting-point metals, their thermal stability and fluidity across diverse temperature intervals. These components are indispensable for guaranteeing the most favorable contact and adhesion between the metal and the semiconductor. Subsequently, a meticulous examination is carried out on the interactions between low-melting-point metals and semiconductors, covering not only physical couplings but also chemical reactions and alterations in interface properties. Moreover, this summary briefly expounds on how LMP metal-embedded semiconductor materials can be utilized in solar cells. This portion focuses on how such composite architectures can enhance photoelectric conversion efficiency while accentuating their manufacturing benefits. Finally, it emphasizes potential applications and future prospects for this composite material within the domains of microelectronics and energy storage.
DOI: 10.54097/3g61qg62
Authors: Chang Liu, Chongquan Wang
Institution: Northeast Forestry University
Language: English
Subfield: Atomic and Molecular Physics, and Optics
Field: Physics and Astronomy
Domain: Physical Sciences
Open Access status: diamond
OpenAlex ID: W4407741565