Work

Terahertz Broadband Characterization of Wafer-Level Packaging Materials Based on SIW Multimode Cavities

Year: 2024

Type: conference-paper

Source: IEEE Asia-Pacific Conference on Antennas and Propagation

DOI: 10.1109/apcap62011.2024.10882064

Authors: Li Xing Zhao, Ya Fei Wu, Zong Rui He, Yang Chai, Yu Jian Cheng

Institutions: University of Electronic Science and Technology of China, Hong Kong Polytechnic University

Language: English

Topic: Microwave and Dielectric Measurement Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

OpenAlex ID: W4407787680

FWCI: 1.612

Cites: 4

Cited by: 2

Related to: 10