A green approach for silicon separation and purification from diamond wire saw silicon powder waste slurry
Year: 2025
Type: article
Abstract: During silicon wafer cutting, a significant amount of diamond wire saw silicon powder (DWSSP) waste slurry is generated, leading to severe oxidation and hindering silicon purification due to prolonged conventional processing. In this study, a green approach based on centrifugation and on-line H 2 SO 4 leaching, is proposed for the silicon separation and purification. The results indicate that under the influence of centrifugal force, rapid solid-liquid separation and impurity removal of the DWSSP waste slurry have been achieved. Direct concentrated H 2 SO 4 to the concentrated liquid eliminates acid mixing, and efficiently purifying while minimizing silicon oxidation interference, reducing total impurity content in silicon-rich powder to 54.8 ppmw. In-situ experiment verifies the total impurity content in silicon-rich powder at 99.5 ppmw, with oxygen content decreased to 2.73 %, confirming the viability of the green silicon purification approach. This study provides crucial guidance for the rapid recovery and preparation of high-purity silicon from DWSSP waste slurry.
Source: Powder Technology
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
Estimated APC paid: $4,610
Funders: National Natural Science Foundation of China, Ministry of Science and Technology of the People's Republic of China, Yunnan Provincial Science and Technology Department, China Academy of Space Technology, National Key Research and Development Program of China, Zhejiang Provincial Outstanding Youth Science Foundation
OpenAlex ID: W4407796210