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Digital lithography technology for the formation of high aspect ratio vias with side wall optimization for dry etch processes on advanced substrates

Year: 2025

Type: conference-paper

DOI: 10.1117/12.3049448

Authors: Cindy K. Mora, Anindarupa Chunder, Qin Zhong, Weihua Qing, Cheng Sun, Nicholas Loo, Jang Fung Chen, Bruce Lee, Carl Li, C.C. Chuang, Niranjan Khasgiwale

Institution: Applied Materials (United States)

Language: English

Topic: Advancements in Photolithography Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4407832839

FWCI:

Cites: 4

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Related to: 10