Work

Spectral reflectometry for process monitoring in high aspect ratio TSV fabrication to improve uniformity

Year: 2025

Type: conference-paper

DOI: 10.1117/12.3050969

Authors: Wen Qii Cheah, Yi-Sha Ku, Po-Wen Chou, Chun-Wei Lo, Cheng-Kang Lee

Institutions: National Tsing Hua University, Industrial Technology Research Institute

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4407833411

FWCI:

Cites: 9

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Related to: 10