Process window analysis using dual layer overlap area between metal via pair
Year: 2025
Type: conference-paper
DOI: 10.1117/12.3051916
Authors: Yun Lin, Jill Freeman, Bruce Wang, Miao Wang, Abdalmohsen Elmalk
Institution: ASML (United States)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4407833493
