Machine learning-based 3D TSV metrology for advanced packaging
Year: 2025
Type: conference-paper
DOI: 10.1117/12.3051271
Authors: Yi-Sha Ku, Po-Wen Chou, Wen-Qii Cheah, Chun-Wei Lo
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4407833667