Advances in machine learning and signal processing enabling expansion of after-etch metrology applications
Year: 2025
Type: conference-paper
DOI: 10.1117/12.3054121
Authors: Giulio Bottegal, Iwan Akkermans, Alok Verma, Mark Yi-Hsuan Chiang, Roberto Cotesta, Martijn Jongen, I-Ju Chen, Bodhi Hopman, Dennis Loeffen, Xuewen Liu, Sjoerd Wiarda, Remco Dirks, Koen Thuijs, Gaurav Nanda
Institution: ASML (Netherlands)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4407833696