Work

Verification of SPI Protocol Using Universal Verification Methodology for Modern IoT and Wearable Devices

Year: 2025

Type: article

Abstract: The Serial Peripheral Interface (SPI) protocol plays a crucial role in wearable and IoT devices, enabling high-speed communication between microcontrollers and peripherals such as sensors, displays, and connectivity modules. With the increasing complexity of modern devices and System-on-Chip (SoC) designs, robust verification methods are essential to ensure functionality and reliability. This paper utilizes Universal Verification Methodology (UVM) to develop a scalable and reusable testbench for SPI verification. The process encompasses test planning, simulation, emulation, and top-level verification to validate scenarios like multi-slave coordination and error handling. The results demonstrate the critical importance of UVM in ensuring the performance and dependability of SPI in advanced electronics, contributing to the reliable integration of the protocol in future devices.

Source: Electronics

DOI: 10.3390/electronics14050837

Authors: Chin-Wen Liao, Hsiu-Chou Yu, Yu-Cheng Liao

Institutions: National Changhua University of Education, Cisco Systems (United States)

Language: English

Topic: Embedded Systems and FPGA Applications

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: gold

Estimated APC paid: $2,896