Work

WIP: Microelectronic Integration in First Year Engineering Education Curriculum for SCALE

Year: 2024

Type: conference-paper

Source: 2022 IEEE Frontiers in Education Conference (FIE)

DOI: 10.1109/fie61694.2024.10893403

Authors: Artre R. Turner, Ben A. Tanay, Kerrie A. Douglas, Melissa A. Dyehouse, Jason W. Morphew

Institution: Purdue University West Lafayette

Language: English

Topic: Engineering Education and Pedagogy

Subfield: Architecture

Field: Engineering

Domain: Physical Sciences

SDGs: Quality education, Decent work and economic growth

Open Access status: closed

OpenAlex ID: W4407950170

FWCI: 10.14

Cites: 21

Cited by: 5

Related to: 10