Work

Effect of External Mechanical Structure of BGA Package on Solder Joint Reliability

Year: 2024

Type: conference-paper

Source: International Conference on Artificial Intelligence and Automation Control (AIAC)

DOI: 10.1109/aiac63745.2024.10899658

Authors: Haijie Luo, Junjie Lang, Jun Xie, Chaoyi Wang, Xiaolong Xu, Jinchun Gao

Institutions: Beijing University of Posts and Telecommunications, China Electronics Technology Group Corporation

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408018311

FWCI: 0.806

Cites: 10

Cited by: 1

Related to: 10