Work

Study of Application of an Active Ultrasound by Use of Zn-Al-Mg-Ti-Based Solder on Selected Substrates

Year: 2025

Type: article

Abstract: ceramics and Cu substrates. The research explores the microstructural characteristics, phase composition, and mechanical properties of the solder and the resulting joints. Particular attention is given to the formation mechanisms of the solder-substrate bond and the role of ultrasound activation in enhancing wettability and bond strength. The study aimed to provide a deeper understanding of active soldering processes and their suitability for high-temperature applications. The findings contribute to advancing lead-free soldering technologies for electronic and structural applications.

Source: Materials

DOI: 10.3390/ma18051094

Authors: Roman Koleňák, Tomáš Meluš, Jaromír Drapala, Peter Gogola, Matej Pašák

Institutions: Slovak University of Technology in Bratislava, VSB - Technical University of Ostrava

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: gold

Estimated APC paid: $3,137

OpenAlex ID: W4408054198

FWCI:

Cites: 26

Cited by:

Related to: 10