Enhancing long-term thermal reliability of sintered joints through the use of silver-coated copper particles
Year: 2025
Type: article
Source: Microelectronics Reliability
Authors: Dajung Kim, Mi so Won, Hyunseung Yang, Chulmin Oh
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Award: G2232126107
OpenAlex ID: W4408060854