Analysis of 3d Integration Technology in Electronics From the Perspective of Monitoring and Diagnostics
Year: 2024
Type: article
Abstract: This article provides a review and analysis of 3D integration technologies from the perspective of control and diagnostics. The main objective of this article is to analyze and compare a wide range of solutions in this area. It examines various technologies that are already widely used in electronics, as well as their differences among themselves and their advantages in certain areas of electronic equipment production. The advantages of three-dimensional integration over other technologies for manufacturing electronic components are determined and the problems of assessing the results of using these technologies when using NDT methods are shown. The main areas of electronics in which these technologies are currently used most widely are identified, including the production of memory units, processors, touch screen controllers and embedded systems. Possible ways for the development of three-dimensional integration have been identified, and problems, primarily quality control in intermediate operations, which currently need to be solved for the further integration of these technologies into production.
Source: Kontrol Diagnostika
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W4408085680