Work

Direct-to-chip immersion liquid cooling for high-power vertical-cavity surface-emitting laser (VCSEL)

Year: 2025

Type: article

Abstract: The performance of high-power laser diodes (HPLDs) is critically dependent on effective thermal management strategies. This study presents an innovative thermal management technique for high-power Vertical-Cavity Surface-Emitting Laser (VCSEL) through direct-to-chip liquid cooling. The effectiveness of this approach was assessed through comprehensive theoretical simulations and experimental analysis. Results indicate that the immersion cooling system facilitates multidimensional heat dissipation, effectively extracting heat from VCSEL arrays and enhancing both efficiency and power stability. In comparison to traditional TEC cooling, immersion cooling lowers junction thermal resistance and increases the optical output power of VCSELs. This comparative advantage makes immersion cooling a more effective solution for HPLD thermal management.

Source: Applied Thermal Engineering

DOI: 10.1016/j.applthermaleng.2025.126137

Authors: Jionghao Wang, Chongxian Yuan, Yang Li, Chuanchuan Li, Yongli Wang, Xin Wei

Institutions: Chinese Academy of Sciences, Institute of Semiconductors, University of Chinese Academy of Sciences

Language: English

Topic: Semiconductor Lasers and Optical Devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: hybrid

Estimated APC paid: $3,660

OpenAlex ID: W4408129102

FWCI: 2.279

Cites: 11

Cited by: 10

Related to: 10