Work

Mesoscopically understanding stress distribution and sensitivity in layered-porous sintered silver for high-power electronics

Year: 2025

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/ssmt-12-2024-0071

Authors: Zhenghu Zhu, Xianyi Zhao, Rongyao Song, Chao Chang, Jiuhua Xu, Changcong Zhou, Xu Long

Institutions: China Aerospace Science and Industry Corporation (China), Nanjing University of Aeronautics and Astronautics, Northwestern Polytechnical University, Taiyuan University of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408137247

FWCI: 1.366

Cites: 37

Cited by: 6

Related to: 10