Spatial atomic layer deposition: Transport-reaction modeling and experimental validation of film geometry
Year: 2025
Type: article
DOI: 10.1116/6.0004367
Authors: Daniel Penley, Neil P. Dasgupta
Institution: University of Michigan
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Funder: National Science Foundation
OpenAlex ID: W4408163397
