Warpage optimization of memory-computing integrated chiplets with 2.5D packaging subjected to electrical-thermal-vibration multistress coupling
Year: 2025
Type: article
Authors: Jie Wu, Guangyao Chen, Shujia Fan, Ruiyang Pang, Yu Liang, Yi Teng
Institution: Nanjing University of Posts and Telecommunications
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4408169931