Work

Electrospun AG80/BN/PI Nanofiber Films with Enhanced Thermal Conductivity for Flexible Circuit Boards

Year: 2025

Type: article

Source: ACS Applied Polymer Materials

DOI: 10.1021/acsapm.4c03712

Authors: Jiahong Xiang, Li GuangMing, Zhenbang Zhang, Tao Chen

Institution: Kunming University of Science and Technology

Language: English

Topic: Thermal properties of materials

Subfield: Materials Chemistry

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Yunnan Provincial Science and Technology Department

Awards: G3411427187, G4578248507

OpenAlex ID: W4408196136

FWCI: 1.669

Cites: 63

Cited by: 8

Related to: 10