Work

Simulation of Electrical-Thermal-Mechanical Deformation in IGBT Modules Under Alternating Loading Current

Year: 2024

Type: conference-paper

Source: Proceedings of the Annual Conference of the IEEE Industrial Electronics Society

DOI: 10.1109/iecon55916.2024.10905111

Authors: Cong Chen, Jiahao Wang, Libing Bai, Jie Zhang, Quan Zhou, Lulu Tian

Institution: University of Electronic Science and Technology of China

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Natural Science Foundation of China, Fundamental Research Funds for the Central Universities

OpenAlex ID: W4408304461

FWCI: 0.799

Cites: 12

Cited by: 1

Related to: 10