Work

Characteristics of PVD SiCN for Application in Hybrid Cu Bonding

Year: 2025

Type: article

Source: JSTS Journal of Semiconductor Technology and Science

DOI: 10.5573/jsts.2025.25.1.102

Authors: Junyoung Choi, Suin Jang, Dongmyeong Lee, Sukkyung Kang, Sanha Kim, Eunkyung Kim

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408315890

FWCI: 1.586

Cites:

Cited by: 7

Related to: 10