Work

A 32 Gb/s 0.36 pJ/bit 3 nm Chiplet IO Using 2.5-D CoWoS Package With Real-Time and Per-Lane CDR and Bathtub Monitoring

Year: 2025

Type: article

Source: IEEE Journal of Solid-State Circuits

DOI: 10.1109/jssc.2025.3545483

Authors: Junhui Gu, John Ma, Azhar Ahmed Chowdhury, Jianmin Guo, Xin Zhang, Jackson Ding, Hui Wang, Ken Chang

Institution: Marvell (United States)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4408324187

FWCI: 1.351

Cites: 10

Cited by: 6

Related to: 10