Work

Study of Solder Bump and Joint Standoff Height Profiles Using Empirical and Numerical Methods

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909761

Authors: Wang Yifan, Yeo Alfred, Chan Kai Chong

Institution: STATS ChipPAC (Singapore)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408324900

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