Work

Exploring Direct Laser Reflow Techniques for Forming Stable and Reliable Solder Bump Interfaces on Semiconductor Substrates

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909952

Authors: Matthias Fettke, Anne Fisch, Thorsten Teutsch

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408324901

FWCI: 0.781

Cites: 7

Cited by: 1

Related to: 10