Work

Impact of Die-Attach Voids on the Thermal Performances of Clip-Bonded Packages

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909785

Authors: Ilyas Dchar, Ding Yandoc

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408324914

FWCI: 2.344

Cites: 7

Cited by: 3

Related to: 10