Work

Resolving Key Issues in Very Thin Die Package Manufacturing

Year: 2024

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc62800.2024.10909750

Authors: Michael Tabiera, Edwin Graycochea, Jefferson Talledo

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4408324926

FWCI:

Cites: 2

Cited by:

Related to: 10